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Reliability Analysis of Self-Repairable MEMS Accelerometer
21st IEEE International Symposium on ...
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Xingguo Xiong, University of Bridgeport, USA
Yu-Liang Wu, The Chinese University of Hong Kong, Hong Kong
Wen-Ben Jone, University of Cincinnati, USA
MEMS (Microelectromechanical System) yield and reliability have been a very critical issue. In our previous paper, we have proposed a self-repairable MEMS comb accelerometer device, and the yield analysis has demonstrated effective yield increase due to the BISR (built-in self-repair) design. In this paper, we developed a MEMS reliability model for quantitative assessment of the MEMS reliability analysis. Based on this model, we analyze the reliability of both non-BISR and BISR MEMS comb accelerometers under Z-axis shocking environment. Simulation results demonstrate very effective reliability enhancement due to the BISR design. The reliability model can also be applied to other MEMS devices under various failure mechanisms in a similar way.
Citation:
Xingguo Xiong, Yu-Liang Wu, Wen-Ben Jone, "Reliability Analysis of Self-Repairable MEMS Accelerometer," dft,pp.236-244, 21st IEEE International Symposium on Defect and Fault-Tolerance in VLSI Systems (DFT'06), 2006
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