2017 IEEE International High Level Design Validation and Test Workshop (HLDVT)
Repair techniques for aged TSVs in 3D integrated circuits
DOI Bookmark: 10.1109/HLDVT.2017.8167463
Authors
Siroos Madani, The Center for Advanced Computer Studies (CACS), University of Louisiana at Lafayette, Lafayette, USAKasem Khalil, The Center for Advanced Computer Studies (CACS), University of Louisiana at Lafayette, Lafayette, USA
Bappaditya Dey, The Center for Advanced Computer Studies (CACS), University of Louisiana at Lafayette, Lafayette, USA
Devante Bonton, The Center for Advanced Computer Studies (CACS), University of Louisiana at Lafayette, Lafayette, USA
Magdy Bayoumi, The Center for Advanced Computer Studies (CACS), University of Louisiana at Lafayette, Lafayette, USA