Abstract
A contactless TSV probe based on the principle of resonant inductive coupling is presented in this work. The proposed scheme allows TSV data observation up to 2Gbps when the probe and TSV are 15µm apart.
2014 IEEE International Test Conference (ITC)
Like what you’re reading?
Already a member?
Related Articles
- Contactless test access mechanism for TSV based 3D ICs
2013 IEEE 31st VLSI Test Symposium (VTS) - A test probe for TSV using resonant inductive coupling
2013 IEEE International Test Conference (ITC) - TSV-to-TSV inductive coupling-aware coding scheme for 3D Network-on-Chip
2014 IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFT) - Capacitive Coupling Mitigation for TSV-based 3D ICs
2015 IEEE 33rd VLSI Test Symposium (VTS) - A novel TSV probing technique with adhesive test interposer
2015 33rd IEEE International Conference on Computer Design (ICCD) - Scan test of die logic in 3D ICs using TSV probing
2012 IEEE International Test Conference - Modeling and Crosstalk Evaluation of 3-D TSV-Based Inductor With Ground TSV Shielding
IEEE Transactions on Very Large Scale Integration (VLSI) Systems - Capacitive and Inductive TSV-to-TSV Resilient Approaches for 3D ICs
IEEE Transactions on Computers - High-Performance and Small-Form Factor Near-Field Inductive Coupling for 3-D NoC
IEEE Transactions on Very Large Scale Integration (VLSI) Systems - Area-Efficient Extended 3-D Inductor Based on TSV Technology for RF Applications
IEEE Transactions on Very Large Scale Integration (VLSI) Systems