2007 IEEE International Conf. on Application-specific Systems, Architectures and Processors (ASAP)
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Abstract

This paper concerns the design and fabrication of new transducer movers dedicated to 3D ultrasound sensors. Our MEMS-based movers were designed using CoventorWare finite element software to maximize the sector and rotation scan angles. These movers are fabricated on silicon wafers using the standard PolyMUMPs process. The design includes both a scanner actuated using four trapezium electrodes and a scanner actuated using vertical comb fingers. According to the simulation results, the required voltage to actuate this latter is significantly less than that required to actuate the platform using electrodes.
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