Abstract
A method for reliability prediction, called SYRP (SYnergetic Reliability Prediction), is presented, based on a combined fuzzy-logic & physics-of-failure approach. SYRP is used for a semiconductor device (thermal sensors) and the estimations, compared with experimental results, prove to be accurate enough. Also, the problems to be solved for using this method for MEMS are presented. The specific case of a MEMS Fabry-Perot interferometer is analyzed and the failure rate estimations are discussed. The method seems to be particularly useful for the reliability analysis made by virtual prototyping.