IEEE Symposium on Low-Power and High-Speed Chips. 2013 COOL Chips XVI
A flexible insertion policy for dynamic cache resizing mechanisms
DOI Bookmark: 10.1109/CoolChips.2013.6547923
Authors
M. Sato, Cyberscience Center, Tohoku Univ., Sendai, JapanY. Tobo, Grad. Sch. of Inf. Sci., Tohoku Univ., Sendai, Japan
R. Egawa, Cyberscience Center, Tohoku Univ., Sendai, Japan
H. Takizawa, Grad. Sch. of Inf. Sci., Tohoku Univ., Sendai, Japan
H. Kobayashi, Cyberscience Center, Tohoku Univ., Sendai, Japan