2012 IEEE 30th International Conference on Computer Design (ICCD 2012)
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Abstract

In this work, we perform a comparative study of different wearout mechanisms affecting the state-of-art microprocessor systems. Taking into account the detailed thermal and electrical stress profiles, we present a methodology to accurately estimate the lifetime due to each mechanism. The lifetime-limiting wearout mechanisms are highlighted using standard benchmarks along with the reliability-critical microprocessor functional units.
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