On-die instrumentation to solve challenges for 28nm, 28Gbps timing variability and stressing

Weichi Ding; Mingde Pan; Wilson Wong; Daniel Chow; Mike Peng Li; Sergey Shumarayev

doi:10.1109/TEST.2012.6401536

2012 IEEE International Test Conference

On-die instrumentation to solve challenges for 28nm, 28Gbps timing variability and stressing

Year: 2012, Pages: 1-7

DOI Bookmark: 10.1109/TEST.2012.6401536

Authors

Weichi Ding, Altera Corporation, San Jose, CA, USA
Mingde Pan, Altera Corporation, San Jose, CA, USA
Wilson Wong, Altera Corporation, San Jose, CA, USA
Daniel Chow, Altera Corporation, San Jose, CA, USA
Mike Peng Li, Altera Corporation, San Jose, CA, USA
Sergey Shumarayev, Altera Corporation, San Jose, CA, USA

Abstract

Moving to the latest submicron node is required for digital scaling but causes many challenges for analog design. Additionally, scaling pushes the need for higher bandwidth. Data rates up to 28Gbps require effectively dealing with random variations and layout dependent effects. On-die instrumentation (ODI) is an effective means to alleviate many of the challenges, as well as characterize and margin performance. This paper covers two of the ODI techniques used in the design of a wide range 28nm, 28Gbps transceiver.

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On-die instrumentation to solve challenges for 28nm, 28Gbps timing variability and stressing

Authors

Abstract

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